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Ten years of research and development has optimized the process of manufacturing extremely thin ( < 250µm ) and planar semiconductor and passive component packages. INTRAGLOBAL MicroSite® and MicroFlange® packages can be embedded and laminated into multilevel interconnect systems and stacked multi chip modules employing existing assembly techniques. INTRAGLOBAL provides custom solutions using wafer level interconnect technology which enables electronic manufacturers to compete and win when size and functionality are demanded in the market place.
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